Electromigration induced strain field simulations for nanoelectronics lead-free solder joints
نویسندگان
چکیده
منابع مشابه
Electromigration in Solder Joints and Solder Lines
Au (0.05 μm) 69.4 μm Electromigration may affect the reliability of flip-chip solder joints. Eutectic solder is a two-phase alloy, so its electromigration behavior is different from that in aluminum or copper interconnects. In addition, a flipchip solder joint has a built-in currentcrowding configuration to enhance electromigration failure. To better understand electromigration in SnPb and lead...
متن کاملElectromigration Performance of Wlcsp Solder Joints
Wafer Level Chip Scale Package (WLCSP) assemblies were tested under high temperature and high current conditions. Electromigration damage was observed along with accelerated diffusion and intermetallic compound growth at the solder / Under Bump Metallization (UBM) interface. Final electrical failure typically occurred due to a void created in the redistribution line (RDL) near the UBM. The fail...
متن کاملThermomigration and electromigration in Sn8Zn3Bi solder joints
Individual effect of thermomigration (TM) and combined effect of TM and electromigration (EM) on the microstructural variation in Sn8Zn3Bi was investigated by stressing line-type Au/Ni–P/Cu-Sn8Zn3Bi-Au/Ni–P/Ni solder joints with a 5 9 10 A/cm alternating current (AC) or direct current (DC) at 110 C. Due to the different thermoelectric characteristics of Cu and Ni wires, a thermal gradient of 19...
متن کاملConcurrent electromigration and creep in lead-free solder
When electric current flows in a solder bump, electromigration generates stress, but creep relaxes it. After some time, the bump develops a steady-state stress field. We present a theory to show that the two processes — electromigration and creep — set an intrinsic length. When the intrinsic length is large compared to the height of the bump, electromigration is fast relative to creep and the s...
متن کاملThermomigration versus Electromigration in Lead-Free Solder Alloys
Competing mechanisms of electromigration and thermomigration in flip chip SnAgCu (SAC) solder joints was studied experimentally. A chain of solder joints were stressed at 2.0 × 10 Amps/cm, 2.4 × 10 Amps/cm, and 2.8 × 10 Amps/cm current density at room temperature. In the test vehicle, some solder joints were exposed to a combination of electromigration and thermomigration, while some others wer...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: International Journal of Solids and Structures
سال: 2007
ISSN: 0020-7683
DOI: 10.1016/j.ijsolstr.2006.12.011